es52f3d20n-18.414m es52f3 d 20 n -18.414m series 3.3vdc 14-pin dip clipped sinewave tcxo operating temperature range -30c to +75c frequency stability 2.0ppm maximum nominal frequency 18.414mhz control voltage none (no connect on pin 1) electrical specifications nominal frequency 18.414mhz frequency stability 2.0ppm maximum (inclusive of operating temperature range) frequency stability vs. input voltage 0.3ppm maximum (5%) aging at 25c 1ppm/year maximum frequency stability vs. load 0.2ppm maximum (2pf) operating temperature range -30c to +75c supply voltage 3.3vdc 5% input current 1.5ma maximum output voltage 0.7vp-p minimum load drive capability 10kohms//10pf output logic type clipped sinewave control voltage none (no connect on pin 1) internal trim 3ppm minimum (top of can) modulation bandwidth 10khz minimum (measured at -3db with a control voltage of 1.65vdc) input impedance 10kohms typical phase noise -70dbc at 10hz offset, -100dbc at 100hz offset, -130dbc at 1khz offset, -140dbc at 10khz offset, - 145dbc at 100khz offset storage temperature range -40c to +85c environmental & mechanical specifications fine leak test mil-std-883, method 1014 condition a (internal crystal only) gross leak test mil-std-883, method 1014 condition c (internal crystal only) lead integrity mil-std-883, method 2004 mechanical shock mil-std-202, method 213 condition c resistance to soldering heat mil-std-202, method 210 resistance to solvents mil-std-202, method 215 solderability mil-std-883, method 2003 temperature cycling mil-std-883, method 1010 vibration mil-std-883, method 2007 condition a www.ecliptek.com | specification subject to change without notice | rev b 3/13/2011 | page 1 of 4
es52f3d20n-18.414m mechanical dimensions (all dimensions in millimeters) pin connection 1 no connect 2 case/ground 3 output 4 supply voltage line marking 1 ecliptek 2 18.414m m=nominal frequency unit of measure 3 xxyzz xx=ecliptek manufacturing code y=last digit of the year zz=week of the year www.ecliptek.com | specification subject to change without notice | rev b 3/13/2011 | page 2 of 4 inter nal t r im access hole ? 3.5 0.5 11.7 0.5 18.3 0.5 4.8 0.3 5.0 1.0 1 2 3 4 4.0 0.3 1.2 +0/-0.5 ? 0.50 0.05 (x4) 2.5 0.3 15.24 0.40 7.62 0.30 4.0 0.3 marking orient a tion output w a veform 0v dc clock output v p-p
es52f3d20n-18.414m www.ecliptek.com | specification subject to change without notice | rev b 3/13/2011 | page 3 of 4 p o w er supply oscilloscope probe (note 2) v oltage meter f requency counter 0.01 f (note 1) 0.1 f (note 1) supply v oltage (v dd ) output no connect ground r l = 10kohms t est cir cuit f or no connect option current meter c l = 10pf (note 3) note 1: an e xter nal 0.1 f lo w frequency tantalum b ypass capacitor in par allel with a 0.01 f high frequency cer amic b ypass capacitor close to the pac kage g round and v dd pin is required. note 2: a lo w capacitance (<12pf), 10x atten uation f actor , high impedance (>10mohms), and high bandwidth (>300mhz) passiv e probe is recommended. note 3: capacitance v alue c l includes sum of all probe and fixture capacitance .
t min s t max s critical zone t to t l p ramp-up ramp-down t l t p t 25 c to peak t preheat s t l t p temperature (t) time (t) recommended solder reflow methods es52f3d20n-18.414m low temperature solder bath (wave solder) ts max to tl (ramp-up rate) 5c/second maximum preheat - temperature minimum (ts min) n/a - temperature typical (ts typ) 150c - temperature maximum (ts max) n/a - time (ts min) 30 - 60 seconds ramp-up rate (tl to tp) 5c/second maximum time maintained above: - temperature (tl) 150c - time (tl) 200 seconds maximum peak temperature (tp) 245c maximum target peak temperature (tp target) 245c maximum 1 time / 235c maximum 2 times time within 5c of actual peak (tp) 5 seconds maximum 1 time / 15 seconds maximum 2 times ramp-down rate 5c/second maximum time 25c to peak temperature (t) n/a moisture sensitivity level level 1 low temperature manual soldering 185c maximum for 10 seconds maximum, 2 times maximum. high temperature manual soldering 260c maximum for 5 seconds maximum, 2 times maximum. low temperature solder bath (wave solder) note 1 device is non-hermetic; post reflow aqueous wash is not recommended low temperature solder bath (wave solder) note 2 temperatures shown are applied to back of pcb board and device leads only. www.ecliptek.com | specification subject to change without notice | rev b 3/13/2011 | page 4 of 4
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